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Chizhou Hisemi Electronic Technology Co., Ltd. was established in October 2014. It is a high-end electronic information manufacturing enterprise focusing on integrated circuit packaging and testing business, including integrated circuit packaging, wafer testing services and chip finished product testing services. In the packaging field, it has core technologies such as multi chip module (MCM) packaging, three-dimensional (3D) stacked core packaging, miniaturized flat pinless (QFN / DFN) packaging, high-density micro spacing integrated circuit packaging and so on.